Push Your Limits - Heraeus Presents Condura®.prime at PCIM Europe 2018

Win with Next Generation Power Packaging Solutions

The power electronics assembly market evolves at a fast pace, competition gets keener. Heraeus enables its customers to reach key targets for the development of their innovations by optimizing materials and materials combinations.


Heraeus presents Condura®.prime at PCIM Europe 2018.

June 5-7, 2018
Messe Nuremberg
Hall: 9, Booth Number: 9-551

Come and meet our experts during the exhibition, and find out how our combined expertise can optimize your processes and results.

Get your free ticket here.

Condura®.prime - Next generation solutions with Active Metal Brazed Substrates

Condura.prime
Substrate layout by courtesy of Fraunhofer IISB

Excellent mechanical properties and a high thermal conductivity of AMB-Si3N4 substrates make Condura®.prime an ideal material for high-reliable power electronics modules.

Silicon nitride (Si3N4) offers excellent mechanical properties (high bending strength, high fracture toughness) and a high thermal conductivity. The outstanding mechanical robustness of Si3N4 enables brazing with thick Cu layers offering additional thermal capacity to dissipate load peaks. Thus baseplates become obsolete for certain applications. AMB-Si3N4 substrates combine best mechanical robustness with excellent heat dissipation properties featuring very high power densities. Optimal performance and reliability can be achieved by using silver sintering, Die Top System (DTS®) and Cu bonding technology. This setup also enables utilizing the full potential of wide bandgap (WBG) semiconductors (SiC, GaN).

For your specific needs, we identify the optimal material combination from our broad product portfolio: metal ceramic substrates with functional surfaces optimized for our sintering, soldering and bonding solutions.

返回顶部