Heraeus Electronics has the know-how to integrate materials into a complete system and to optimize materials and material combinations. This is achieved through an innovative product portfolio, high application competence and expertise in combining materials. The company supports its customers in achieving their development goals:

shorter development cycles, lower costs, and faster time-to-market for the next generation of products
developing smaller devices and end products with enhanced functionalities
equipping their products with electronics that offer higher power density and longer life even under extreme conditions
focusing on forward integration

Technical challenges in the electronics market: With each new generation, electronic devices have to fit more functions into a smaller space. The development goals are to reduce the weight and size of devices, increase reliability, and comply with new regulatory requirements. Electronic components consist of many materials: substrates, connectors, active and passive components, solders, adhesives, bonding wires, insulation and molding materials, and packages. At the Heraeus Application Center, expertise in materials, processing and application testing is combined to provide the best possible solutions to technical challenges.

Sintering: Sintering technology is a real alternative to the conventional soldering process in electronics manufacturing. Especially in view of the upcoming challenge of higher performance, higher reliability at high temperatures, this technology helps customers to be prepared for future electronic products.

Unicornis GmbH

Allgemeines

GV I

GV II

Versammlungen am 13. Juni 2026

Übersicht Gesellschafterversammlungen