Memory devices in the semiconductor industry rely heavily on gold for wire bonding. While electronic devices are constantly evolving and need more storage capacity, the need for cost-effective production is growing.
With AgCoat™ Prime Heraeus offers a real alternative to gold wire for the memory device packaging. AgCoat™ Prime is a silver alloy bonding wire coated with a layer of gold. Because AgCoat™ Prime's specifications are closely aligned to gold bonding wire, no inert gas is required, so no investment or changes to production equipment and facilities are necessary.
Curious? - Get in touch with us. Our engineers will be happy to meet you and discuss next steps.
Key benefits of AgCoat™ Prime:
- A plug & play cost effective substitution for gold wire in the semiconductor memory segment.
- No CAPEX investment needed for both new wire bonders and facilities infrastructure.
- Eliminates the need of protection gas and kit during Free Air Ball (FAB) formation.
- Heraeus engineers are available onsite to ensure your success.