Heraeus Electronics to Participate in Global Semiconductor Forum, March 9-11, 2016

Shanghai, March 09, 2016

  • Company to share its latest advancements packaging materials to improve performance in micro and power electronics.

Heraeus Electronics, a leading provider of materials solutions for the semiconductor and communications electronics industries, will sponsor the Welcome Dinner of the Global Semiconductor Forum (GSF), which takes place Wednesday, March 9th through Friday, March 11th, 2016 at the Shanghai Marriott Hotel City Centre. The three-day event, which encompasses the end-to-end value chain of electronics development and production, gives technology leaders from around the world the opportunity to network with peers, discuss issues and discover some of the latest innovations in the semiconductor industry.

On Friday, March 11th, as part of the world-class panel of presenters and subject matter experts, Dr. Frank Stietz, President of Heraeus Electronics, will share his insights on the important role packaging materials will play in elevating the performance and functionality of micro and power electronics. His technical presentation will include updates on the promising R&D work that Heraeus Electronics has conducted to create new materials for:

  • highly integrated devices
  • new materials for high power electronics and thermally demanding applications
  • and Materials Systems and Matched Materials for power electronics

Commenting on his upcoming presentation, Dr. Stietz said, “Raising performance standards is a challenge for the entire semiconductor industry. We believe that the key is systems materials, which is why we are excited to share updates on our progress creating even higher-performing materials for our customers. It means a trio of benefits for micro and power electronics companies: greater performance, improved functionality and reliability and the ability to accelerate innovation.”

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