World’s first zero-splatter paste and new sinter pastes from Heraeus Electronics deliver greater reliability, performance and extended lifetime in the most demanding environments

TAIPEI, Taiwan- September 13, 2017

Innovative new WS5112 Water-soluble Fine Pitch Solder Paste and mAgic® Sinter Pastes to be showcased at Semicon Taiwan Show, September 13th to 15th

Packaging

Heraeus Electronics, a leading provider of materials solutions for the semiconductor and electronic packaging industries, today announced two new pastes designed to meet demanding requirements in semiconductor and power electronics applications. Technical information on both product lines will be available at the Heraeus Electronics booth (#2546, 1st floor) at Semicon Taiwan Event, which takes place September 13-15 at Taipei Nangang Exhibition Center in Taipei, Taiwan. As the world’s first company to commercially produce zero-splatter paste, the pastes being showcased at Semicon Taiwan reflect the commitment of Heraeus Electronics to provide even greater performance for customers.

Heraeus Electronics WS5112 solder paste is the latest innovation in water-soluble solder pastes to provide unparalleled performance in demanding processes and applications. Designed to reduce defects and improve yield, WS5112 is a water-soluble, halogen-free paste that has zero-splattering (splashing) and long staging life due to its excellent inherent rheological properties, offering superior fine pitch printing performance. WS5112 flux platform can support various alloys and powder types down to type 7. Additionally, the paste produces minimal, easily cleanable residues while providing excellent wetting.

The Heraeus Electronics mAgic® non-pressure Sinter Paste lives up to its name to work like magic to improve lifetime and thermal performance of power packages and power electronics. Developed as a lead-free, Halogen Zero formulation, the ASP295-09P9 mAgic® Sinter Paste is an effective die-attach solution for segments such as power discrete, HP LED and RF power devices. The paste series delivers significant benefits, including:

  • Low sintering temperature at 200 ºC
  • Improved thermal conductivity compared to solder paste application requiring higher thermal dissipation and adopting higher power density
  • Reduced processing costs, as no flux cleaning after processing is required

Dr. Michael Joerger, Global Head of Innovation for Heraeus Electronics, noted that while events like Semicon Taiwan bring together a broad range of market segments, the Heraeus innovation roadmap remains unchanged. “Whether our customers are involved in manufacturing, equipment or materials, our goal is the same: to deliver products that perform flawlessly in the most demanding processes, environments and applications. Our water soluble solder paste and mAgic® Sinter Paste are just two examples of why we invest so heavily in our global research and development network.”

In addition to exhibiting at Semicon Taiwan, Li-San Chan, Global Product Manager at Heraeus Electronics, will provide a technical presentation on Advanced Packaging SiP Solder Materials Solutions on Thursday, September 14 from 1:00 to 1:30 PM at TechXPOT 1F (Materials Section), Booth #3120.

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