German tech company Heraeus provides new advanced material portfolio for Japan’s booming automotive market

Tokyo, Japan – 16.01.2020. Heraeus showcases at NEPCON its extended portfolio for the future of mobility. Going forward, mobility will be connected, autonomous, shared and electrified. Heraeus offers an improved portfolio catering to these trends and their specific challenges.

Electrification: Achieving superior reliability

The e-mobility market is characterized by a high innovation ratio as well as high demands for new mobility solutions regarding safety and reliability. Compared to many other areas of electrified applications, vehicle components must withstand higher loads for a much longer period. Against this backdrop, the use of high-quality materials is one of the most important success factors in international competition.

Heraeus’ solutions:

Heraeus extends its mAgic sinter portfolio with DA295A. The paste is suitable for non-pressure sintering, which offers superior thermal conductivity and high melting points. This enables power devices to operate at higher temperatures and improves reliability.

Heraeus introduces new bonding ribbons with CucorAl Plus and PowerCu Ribbon. These products offer improved reliability, which comes from a robust metal-to-metal connection. Both products also offer improved stability from a minimal inter-metallic compound’s formation.

Power electronics modules are responsible for the energy management in electric vehicles. Heraeus offers specially developed sinterable temperature sensors, which optimally use the performance of the total system. High-precise temperature measurement is essential for many key technologies, and a prerequisite for effective technical solutions.

Connectivity: Design-flexibility for interior interfaces

Connectivity makes mobility safer, more efficient and more convenient. Car interior surfaces are trending towards touch interfaces and consoles, incorporating capacitive sensing and switching. This allows a longer lifespan of interfaces as well as more design flexibility for in-car entertainment and navigation systems. Innovative electronic materials play a key role to design innovative interfaces.

Heraeus’ solutions:

To offer maximum design flexibility Heraeus offers the conductive polymer Clevios. By using Clevios for printed electronics, manufacturers achieve maximum design flexibility and freedom for curved, 3-D molded surfaces in car interiors, for example, interfaces seamlessly inserted into the dashboard. Car manufacturers can realize cost, weight and volume savings by replacing many mechanical switches with a thin functional film.

In order to reduce the form factor and weight of electronic modules in cars, Heraeus also offers broad-based solder materials for SMT components such as passive and LED components as well as for fine pitch SiP (System-in-Package).

Autonomous Driving: Improve safety systems

Adaptive cruise control, forward collision warning and autonomous emergency braking are central components in many Advanced Driver Assistance Systems (ADAS) and safety systems. Materials not only have to function reliably in extreme heat but also in other critical harsh environments.

Heraeus’ solutions:

Heraeus extended automotive portfolio consisting of mAgic sinter paste DA295A as well as the bonding ribbons CucorAl Plus and PowerCu Ribbon also caters to achieving higher reliability and performance for autonomous driving applications.

NOTE TO JOURNALISTS: Are you attending Nepcon Japan in Tokyo? Meet our team at the following booths: 21st Electronic Materials & Components Expo (Heraeus Epurio): South Hall S20-6 6th Car-Mecha Japan (Heraeus Noblelight): West 4 Hall W27-16.