The packaging and joining technology used in power electronic modules has an influence on the actual module performance that cannot be underestimated. Merely optimizing individual joining and packaging materials is only of limited benefit to the performance of the power module. Therefore, a matched materials system offers unique advantages. Heraeus is the leading partner offering a superlative range of matched materials developed in close collaboration with the customer for power electronic systems.
Find out more at our booth.
Furthermore we cordially invite you to attend Noriyukis Okubos technical presentation on HET Materials Solutions and Services for Packaging of Power Electronic Modules on April 19, 2018, from 11.00 - 11.50 AM within the exhibition hall.
The Die Top System significantly improves the electrical, thermal and reliability performance of the die connection and improves the whole module performance.
Our solder paste for DCB die attach provides lowest voiding and highest reliability in state of the art assembly processes. It is lead and halogen free, for environmental compliance.
Heraeus CucorAl (Al cladded Cu Wire) combines the advantages of aluminium and copper wire. The material mix of aluminum and copper provides excellent electrical and mechanical properties.
Heraeus corrosion resistant wires fulfil the increasing requirements on the reliability of bonded connection in automotive and power electronics.