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Products and Solutions

Heraeus at NEPCON Japan 2020

The power electronics assembly market evolves at a fast pace, competition gets stronger. Heraeus enables its customers to reach key targets for the development of their innovations by optimizing materials and materials combinations. Our innovative product portfolio, application knowhow and expertise in matching materials qualifies Heraeus to support you in a unique way.

Stop by at our booth and learn how to maximize reliability with our next generation materials:

Date: 15 – 17 January 2020
Venue: Tokyo Big Sight, Japan
Exhibition Zone: 21st IC & Sensor Packaging Technology Expo, West Hall, 1F
Booth: #W11-41

Request your free visitor ticket to NEPCON Japan.

Join our expert presentation

Maximize reliability and power density through Die Top System

15 January 2020, 10:30AM – 12:00PM
Session/ ID: IC & Sensor Packaging Technology Expo Technical Session/ ISP-2
Venue: Exact room to be confirm ꟾ Tokyo Big Sight, Japan

Speaker:
Anton Z. Miric, Vice President Management, Materials Solutions

Abstract:
Die Top System (DTS®) consists of a thin copper foil with pre-applied sinter paste placed on top of the die that enable copper wire or ribbon bonding. DTS® is sintered together with the die in one step and replaces aluminum wire bonding and soldering, which are technologies limiting the reliability and current density of standard modules.

Application for Nepcon Conference.

Maximize reliability with mAgic® sinter paste

15, January 2020, 12:20PM – 13:20PM
Venue: Presentation room in West Hall, Level 2 ꟾ Tokyo Big Sight, Japan 

Speaker:
Noriyuki Okubo, Business Development Manager, Japan

Abstract:
High power density devices drive operating temperature higher. Selecting superior packaging materials to complement SiC-enabled power devices to operate reliably is more challenging than imagine. mAgic® sinter paste relieves the thermal bottleneck to increase device lifetime. Accelerate development cycle with our assured sintering solution.

Get in touch with our experts

Anton Z. Miric

Vice President Management, Materials Solutions
  • Send Mail
Nori-san Okubo

Noriyuki Okubo

Business Development Manager, Japan
  • Send Mail
Kiyoshi Komatsu

Kiyoshi Komatsu

Senior Manager, Electronics, Heraeus K.K.
  • Send Mail

Our product highlights

magic

NEW! mAgic® DA295A non pressure sinter paste with excellent workability

Designed for high volume manufacturing, the new mAgic® DA295A sinter paste is a lead free, non-pressure dispensing sinter paste for die attach in high performance semiconductor packages.

DA295A sinter paste increases high power density packages robustness, enables higher operating temperature and ultimately extends the device’ lifetime performance. Its improved material properties enhances workability, improves throughput and reduces total cost of ownership.

coated wire

NEW! Power bonding wires & ribbons for high performance power devices

CucorAl Plus – Copper core aluminum wire for high power application

Heraeus copper core aluminum wire combines the advantages of aluminum and copper within one wire. The material mix of Aluminum and Copper provides excellent electrical and mechanical properties and can be used on standard Al-Chip surfaces to improve power density and module lifetime.

powercu soft bonding wire

PowerCu Soft ribbon – Enable maximum power density at highest lifetime

The preferred material for the next generation of power devices, targeting up to 225°C module operation temperature and improves customers UPH at the same time*.

*depending on module design and layout

dts Substrate layout by courtesy of Fraunhofer IISB

Get the most out of your power module with Heraeus Die Top System (DTS®)

You are interested to boost lifetime and power density in your power modules? Free yourself from the technical limitations of today’s standard and discover Heraeus Die Top System (DTS®).

DTS® significantly improves the electrical, thermal and reliability performance of the die connection thus improving the whole module performance.

Interested? Find out more about Heraeus DTS® here.

sensor

Sinterable temperature sensors for Power Electronics

High-precise temperature measurement is essential for many key technologies, and a prerequisite for effective technical solutions. Power electronics modules are responsible for the energy management in electric vehicles. Heraeus offers specially developed sinterable temperature sensors, which optimally use the performance of the total system.

Find out more about the advantage of the sinterable temperature sensor.

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