Stop by at our booth and learn how to maximize reliability with our next generation materials:
Date: 15 – 17 January 2020
Venue: Tokyo Big Sight, Japan
Exhibition Zone: 21st IC & Sensor Packaging Technology Expo, West Hall, 1F
Booth: #W11-41
Heraeus at NEPCON Japan 2020
The power electronics assembly market evolves at a fast pace, competition gets stronger. Heraeus enables its customers to reach key targets for the development of their innovations by optimizing materials and materials combinations. Our innovative product portfolio, application knowhow and expertise in matching materials qualifies Heraeus to support you in a unique way.
Join our expert presentation
Maximize reliability and power density through Die Top System
15 January 2020, 10:30AM – 12:00PM
Session/ ID: IC & Sensor Packaging Technology Expo Technical Session/ ISP-2
Venue: Exact room to be confirm ꟾ Tokyo Big Sight, Japan
Speaker:
Anton Z. Miric, Vice President Management, Materials Solutions
Abstract:
Die Top System (DTS®) consists of a thin copper foil with pre-applied sinter paste placed on top of the die that enable copper wire or ribbon bonding. DTS® is sintered together with the die in one step and replaces aluminum wire bonding and soldering, which are technologies limiting the reliability and current density of standard modules.
Maximize reliability with mAgic® sinter paste
15, January 2020, 12:20PM – 13:20PM
Venue: Presentation room in West Hall, Level 2 ꟾ Tokyo Big Sight, Japan
Speaker:
Noriyuki Okubo, Business Development Manager, Japan
Abstract:
High power density devices drive operating temperature higher. Selecting superior packaging materials to complement SiC-enabled power devices to operate reliably is more challenging than imagine. mAgic® sinter paste relieves the thermal bottleneck to increase device lifetime. Accelerate development cycle with our assured sintering solution.
Get in touch with our experts
Our product highlights
NEW! mAgic® DA295A non pressure sinter paste with excellent workability
Designed for high volume manufacturing, the new mAgic® DA295A sinter paste is a lead free, non-pressure dispensing sinter paste for die attach in high performance semiconductor packages.
DA295A sinter paste increases high power density packages robustness, enables higher operating temperature and ultimately extends the device’ lifetime performance. Its improved material properties enhances workability, improves throughput and reduces total cost of ownership.
NEW! Power bonding wires & ribbons for high performance power devices
CucorAl Plus – Copper core aluminum wire for high power application
Heraeus copper core aluminum wire combines the advantages of aluminum and copper within one wire. The material mix of Aluminum and Copper provides excellent electrical and mechanical properties and can be used on standard Al-Chip surfaces to improve power density and module lifetime.
PowerCu Soft ribbon – Enable maximum power density at highest lifetime
The preferred material for the next generation of power devices, targeting up to 225°C module operation temperature and improves customers UPH at the same time*.
*depending on module design and layout
Get the most out of your power module with Heraeus Die Top System (DTS®)
You are interested to boost lifetime and power density in your power modules? Free yourself from the technical limitations of today’s standard and discover Heraeus Die Top System (DTS®).
DTS® significantly improves the electrical, thermal and reliability performance of the die connection thus improving the whole module performance.
Sinterable temperature sensors for Power Electronics
High-precise temperature measurement is essential for many key technologies, and a prerequisite for effective technical solutions. Power electronics modules are responsible for the energy management in electric vehicles. Heraeus offers specially developed sinterable temperature sensors, which optimally use the performance of the total system.
Find out more about the advantage of the sinterable temperature sensor.