For memory packaging and next-generation material innovations, the microelectronics and semiconductor industries turn to Heraeus Electronics. Innovative materials solutions from Heraeus enable customers to develop new solutions for higher current density, addressing integration challenges and to answer the demand for improved reliability, miniaturization and cost efficiency.
Heraeus Electronics at SEMICON Taiwan 2019
Showcasing Advanced Materials for Your Packaging Solutions
Meet our products and technical experts at SEMICON Taiwan:
Date: September 18 to 20
Venue: Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1)
Booth: #I2408, 1F
Technology breakthrough: AgCoat™ Prime
A perfect substitute for gold wire in the memory market that the industry has been waiting for!
Heraeus is the 1st in the world to showcase an innovative product that substitutes costly gold wires for memory packaging. Introducing AgCoat™ Prime – a gold coated silver wire which provides uncompromised reliability and workability with lowest cost of ownership.
Does size really matter?
Layout and form factor are crucial for System in Package design. How to pack more components in a small package?
Join our game to find out and win prizes.
Secure Your Key to Future Power Electronics
Expert Presentation at TechXPOT SEMICON Taiwan
Date: September 18
Time: 2:20PM – 2:40PM
Venue: 1F
Learn more about mAgic™ sinter paste and Die Top System (DTS®) to maximize performance and improve robustness for Automotive Power Electronics.
- Powertrain electronics becomes an integral part of automotive electronics.
- Performance and reliability requirements are more demanding in order to operate in extreme environment.
- Soldered connections are reaching their limits. Challenges to implement higher current carrying capacity for higher power density.
- Innovative power performance materials from Heraeus provides constructive solutions to outperform these challenges effectively.
Speakers:
Innovative packaging material increases modern automotive electrification modules performance and robustness. Heraeus Electronics provides a comprehensive suite of power performance materials with superior properties to enable operation at extreme temperature, handle power density increase and extend device service life.
Other Product Highlights at SEMICON Taiwan
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Welco® AP5112 Water Soluble, Halogen-Free Solder Paste
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Water Soluble Smartflux
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mAgic™ Sinter Paste (Pressure and Non-Pressure)
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Layout by courtesy of Fraunhofer IISB Die Top System (DTS®) – Get the most out of your power module
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Condura® – Metal Ceramic Substrates Portfolio from DCB to AMB
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Condura®+ Alumina substrate with pre-applied solder
For significantly lower defects and better yield. Environmentally friendly.
This combination of high tacky fluxes and special solder powders significantly improves yields for high value packages and devices utilizing copper or tin metallizations.
Increase lifetime and thermal performance of your products with our mAgicTM sinter paste.
DTS® significantly improves the electrical, thermal and reliability performance of the die connection thus improving the whole module performance.
Choose of 19 options to maximize your success in power electronics module production.
Up to 50 % less process steps for die soldering with our pre-soldered DCBs.
