March 17-19, 2021 // Shanghai, China
Rely on more than one century of material experience in quartz.
When: March 17- 19, 2021
Where: Hall E7.7535 at Shanghai New International Expo Center (Shanghai, China)
Making use of all established raw materials and processes in the production of quartz and fused silica, Heraeus enables customers to use specific materials tailored to their particular needs.
Combining advanced knowledge in raw materials and production technology collected over 100 years allows Heraeus to provide almost unlimited possibilities to help you master your quartz and silica material challenges.
A century of material experience
Heraeus Clear Fused Quartz solutions offer the best in class, lowest levels of inclusions and bubbles, meeting even the requirements of the most challenging applications.
The unique thermal management solution
Heraeus Opaque Quartz OM® is a high purity opaque quartz glass. The proprietary technology results in a unique microporosity that provides superior thermal characteristics when compared to other opaque materials.
A revolutionary hybrid material
Heraeus Black Quartz (HBQ®) is a unique black opaque quartz glass composite that benefits from high purity and other properties of our opaque and clear fused quartz solutions.
Leading Edge Technology requires a Leading Edge Fused Silica Partner
Within the chip manufacturing batch systems are used for deposition and high-temperature processes. As quartz is the only material being in direct contact with the silicon wafer it is a game changing component in the system. Being a well established fabricator Heraeus is a qualified partner for all major OEMs by using our high quality raw materials.
| Time | Topic | Speaker | |
|---|---|---|---|
| 10:20 – 10:40 | Fabricated Quartz: HSQC Company and Main Products Introduction | Louis Liu | Technical Sales Manager | More details |
| 10:40 – 11:00 | Prexonics® Semiconductor EMI Shielding Solution | Jason Li | Sales Director | More details |
| 13:20 – 13:40 | Addressing the Challenges of Ultra-Fine Pitch Advanced Packaging Applications with Heraeus Advanced Packaging Solutions | Jorson Sun | Technical Solutions Engineer | More details |
| 13:40 – 14:00 |
AgCoat® Prime – An Alternative Solution to Gold Bonding Wire |
Song Jian Bo | Bonding Wire Application Lab Supervisor | More details |
| 14:00 – 14:20 | Accelerate your Packaging Development with Heraeus’ Advanced Engineering Services | Zhang Jing | Head of Innovations China | More details |
| 14:20 – 14:40 | Total Thermal Management Solution for Semiconductor from Heraeus Quartz Glass | Golden Gu | Sales Director. | More details |
