Fused quartz and silica hollows are needed in the fabrication of single wafer processing equipment for plasma etch and deposition systems.
Heraeus Conamic manufactures fused quartz and silica hollows in different material grades and dimensions. The provided hollows are characterized by high purity and material homogeneity while maintaining low bubble contents.
In the following you will find an overview of the different fusion technologies that Heraeus Conamic can utilize, each highlighted by the leading material advantage in this segment.
Flame Fused Quartz Hollows
Heraeus Conamic uses continuous fusion technology to produce TSC® flame fused quartz hollows. This unique process allows customers to utilize material that features very low levels of bubbles and inclusions while maintaining high purity.
Synthetic Fused Silica Hollows
For addressing the most demanding needs of the semiconductor industry, Heraeus Conamic produces synthetic fused silica hollows. TSC-T® is the corresponding material grade that is characterized by parts per billion class purity and zero bubble content.
Fused quartz and silica hollows are available to meet the tight purity and visual requirements in the fabrication of single wafer processing equipment such as focus rings for plasma etch systems.
Heraeus Conamic portfolio covers multiple grades to address all OEM requirements including challenging ultra-high purity specifications.
