Heraeus Electronics, a leading provider of material solutions for electronics packaging, today announced the launch of a new sinter paste. The new paste with the product name mAgic DA295A is a low temperature, non-pressure sintering solution and part of Heraeus’ mAgic sinter pastes product series. It offers superior thermal conductivity and is suited for power applications with high operation temperatures.
“We are constantly developing new die attach materials optimized for the growing demands of power semiconductors," says Dr. Klemens Brunner, President of Heraeus Electronics. "Our new paste mAgic DA295A enables devices to achieve higher performance and higher reliability – especially for high frequency power amplifier packages.”
Due to its patented formulation, mAgic DA295A creates a robust pure silver die-attach layer with high thermal dissipation. The improved formulation further widens the processing window to reduce the overall cost of ownership. Moreover, mAgic DA295A’s simple processing provides flexibility and improved workability characteristics to benefit manufacturability. Heraeus is the only sinter paste supplier using micro scaled Silver powder. This ensures higher yields, a wider process window and is less expensive compared to nano powders.
Heraeus not only provides high-quality sinter materials, but also makes its process knowledge available to customers. In its power electronics application centers, the company helps manufacturers to improve their processes by jointly simulating them and developing prototypes. Manufacturers furthermore benefit from Heraeus’ sinter seminars and training courses.
There is a growing demand in the power electronics industry for connecting materials that have high melting temperatures and fatigue resistances, improved thermal conductivity, and reduced electrical resistivity. These materials ensure high reliability while allowing higher power densities, operating temperatures and switching frequencies. Silver sinter pastes, like Heraeus’ mAgic products, offer an alternative to solder pastes increasing the lifetime of devices up to ten times.