Heraeus Electronics, a leading supplier of material solutions for packaging technology, and the Fraunhofer Institute for Integrated Systems and Device Technology (IISB) recently launched a joint program for master's theses on power electronics. Both partners agree to jointly supervise two to four master theses per year on current research and development topics. The collaboration, initially planned for two years, is intended to link Fraunhofer IISB's expertise in power electronics components and systems with current and practically relevant issues and material developments for electronics applications from Heraeus.
"We see the collaboration as a win-win situation in which we can apply our joint strengths to build on each other," says Dr. Sebastian Fritzsche, head of the cooperation program at Heraeus in Hanau. "Heraeus' current development goals include increasing the reliability and efficiency of microelectronic systems, especially systems for power electronics and their use at higher operating temperatures."
“Fraunhofer IISB focusses on advanced packaging technologies and new materials for efficient and reliable power modules”, adds Dr. Christoph Bayer, group manager for Packaging Technologies at the Fraunhofer institute.
The research work for the theses will mainly be carried out in the labs of Fraunhofer IISB in Erlangen, complemented by selective activities at Heraeus in Hanau. Interested students can find information on related theses on herae.us/masterthesis