Heraeus introduces new advanced packaging solutions to elevate device performance at SEMICON Taiwan

Taipei, Taiwan – 14 September 2022

Heraeus Electronics will present three new products to elevate device performance during SEMICON Taiwan at TaiNEX 1 in Taipei on September 14 – 16. Mega trends such as 5G, artificial intelligence and high-performance computing continue to play a part in revolutionizing the semiconductor market. New material solutions are needed to meet the increasing demand and challenges of semiconductor advanced packaging. Heraeus’ new products offer solutions in terms of thermal dissipation, miniaturization, defect challenges and shielding against electromagnetic interferences (EMI).

Fast Thermal Relief of Semiconductor Packaging targeting RF Power Amplifiers

5G increases bandwidth and reduces latency to provide mass information transfer. RF power amplifier is a critical device supporting high-speed frequency switching. In GaN-based devices, the faster processing capacities increase operating temperature, which negatively affects device reliability. Operating above the temperature window also has an undesirable effect on energy efficiency and performance.

The Heraeus solution:

Heraeus Electronics answered the industry’s increasing needs to keep semiconductor packages cool for reliable operation with its new mAgic DA320 sinter paste. This is a non-pressure die attach product that possesses superb thermal conductivity of >200 W/mK to accelerate heat generated from die to substrate. It achieves outstanding shear strength in combination with low voiding to produce an exceptional interconnection, suitable for die sizes up to 5x5mm and thinness of 60um. Wide band gap devices demand the best packaging technology with the lowest thermal resistance to reduce operating temperature and enable higher reliability. DA320 features are ideal for Silicon Carbide (SiC), Gallium Nitride (GaN) and other top-of-line power devices.

Complex Electronics with a Small Form Factor

The semiconductor advanced packaging industry and related technologies serve the need of fast-evolving and increasingly complex electronic products used in 5G communications, Internet of Things, AR and smart wearables, electric vehicles, and other consumer or industrial applications. As constantly driven by higher performance and smaller form factors, the number of components in semiconductor packages such as the system-in-package (SiP) continue to increase while the package size decreases. To meet the demand of today’s electronic industry, solder materials that can create tiny and reliable joints with close to zero defects are needed.

The Heraeus solution:

Heraeus Electronics’ new Welco AP520 is a state-of-the-art water-soluble type 7 printing paste designed to address these challenges. With excellent paste release down to 90 µm pitch (55 µm stencil opening and 35 µm line spacing), no splashing and best-in-class low void performance, AP520 makes an excellent choice for fine pitch components and flip chip attach for next generation System-in-Package applications. In addition, Welco AP520 T7 solder paste makes all-in-one printing for flip chip and SMD pads possible. This simplifies SiP assembly processing steps, reduces CAPEX and material costs, and at the same time, eliminates defects such as incomplete soldering due to substrate warpage and/ or uneven placement of flip chips.​

High-Performance Computing (HPC) Defect Challenges

HPC is increasingly prevalent in everyday life, with specific applications in processors for Artificial Intelligence applications, GPU and CPUs for gaming computers and consoles, mobile processors for 5G smartphones, autonomous driving, memory controllers and more. High bump-count and fine bump-pitch flip chips are the enabling technology for HPC and need to be reliably soldered onto substrates. This advanced packaging process faces huge challenges to eliminate defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. A carefully designed flux material plays an essential part in addressing these defect challenges.

The Heraeus solution:

Heraeus Electronics’ new AP500 is a water-soluble, halogen-zero tacky flux specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. AP500 flux delivers superior wettability on various pad finishes such as Copper Organic Solderability Preservative (CuOSP) and Electroless Nickel Immersion Gold (ENIG),and offers a long work life and easy cleanability by DI water after reflow.

Electromagnetic Interferences in 5G Devices

The trend toward connected devices, miniaturization and 5G is persistent, especially in mobile phones. This has led to a need for enhanced shielding from electromagnetic interferences (EMI), both within the device and also against the electromagnetic noise from outside the device.

The Heraeus solution:

Prexonics developed by Heraeus Printed Electronics is a complete system solution for package level EMI shielding. It optimizes EMI shielding while ensuring proper functioning of high-frequency onboard chips and their ultra-fast data transmission. The system consists of particle-free silver ink and a manufacturing process that uses the Prexonics inkjet printer to apply the shielding coating. This inkjet process enables selective coating of 0.5 to 4 μm, offering full design flexibility and the elimination of masking and etching steps.

In addition, Heraeus Electronics will showcase its extended product portfolio towards sustainability initiatives with gold bonding wire made with 100% recycled gold and Welco solder paste series made with 100% recycled tin. Both Heraeus gold and tin suppliers comply with Responsible Materials Initiatives (RMI) and IS014021:2016.

​To learn more, visit Heraeus experts at booth #L0426, 4F (Materials Pavilion).