Heraeus at EPTC 2019

Make Yourself Future Ready with Our Next Generation Materials

Join our experts presentations at EPTC 2019

Micro-interconnects: Signal integrity in 5G applications

05. December 2019, 2:05PM – 2:35PM
Location: 3813
Speaker: Dr. Sarangapani Murali
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Die attachment on bare Cu surface by non-pressure silver sintering in inert atmosphere

05. December 2019, 4:20PM - 5:40PM
Location: 3813
Speaker: Ly May Chew
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Enables Cu pillar flip chip attach with T7 lead-free solder paste

05. December 2019, 10:30AM – 11:15AM
Location: Jasmine Foyer
Speaker: B Senthil Kumar
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A new die attach material for high power electronic device

06. December 2019, 2:15PM – 3:15PM
Location: 3911
Speaker: Zhang Rui Fen
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Characterization of coating on fine interconnect materials

06. December 2019, 2:15PM – 3:15PM
Location: 3811
Speaker: Yam Lip Huei
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