Heraeus at EPTC 2019

Make Yourself Future Ready with Our Next Generation Materials

Visit Heraeus Electronics at EPTC 2019 and learn more about our latest innovations and material solutions.

Date: 4 – 6 December, 2019
Venue: Marina Bay Sands Singapore, Level 3, Hibiscus Main Ballroom
Booth: #12

Meet our product, technical and R&D experts during the exhibition, and find out how we can assist you in optimizing materials and material combinations to maximize your yield and bring next generation products faster to the market.

Our product highlights at EPTC 2019

Join our experts presentations at EPTC 2019

Micro-interconnects: Signal integrity in 5G applications

05. December 2019, 2:05PM – 2:35PM
Location: 3813
Speaker: Dr. Sarangapani Murali

Die attachment on bare Cu surface by non-pressure silver sintering in inert atmosphere

05. December 2019, 4:20PM - 5:40PM
Location: 3813
Speaker: Ly May Chew

Enables Cu pillar flip chip attach with T7 lead-free solder paste

05. December 2019, 10:30AM – 11:15AM
Location: Jasmine Foyer
Speaker: B Senthil Kumar

A new die attach material for high power electronic device

06. December 2019, 2:15PM – 3:15PM
Location: 3911
Speaker: Zhang Rui Fen

Characterization of coating on fine interconnect materials

06. December 2019, 2:15PM – 3:15PM
Location: 3811
Speaker: Yam Lip Huei