Heraeus at EPTC 2019

Make Yourself Future Ready with Our Next Generation Materials

Visit Heraeus Electronics at EPTC 2019 and learn more about our latest innovations and material solutions.

Date: 4 – 6 December, 2019
Venue: Marina Bay Sands Singapore, Level 3, Hibiscus Main Ballroom
Booth: #12

Meet our product, technical and R&D experts during the exhibition, and find out how we can assist you in optimizing materials and material combinations to maximize your yield and bring next generation products faster to the market.

Heraeus at EPTC

Our product highlights at EPTC 2019

EMI Shielding Solution

EMI Shielding Solution

Looking for an EMI Shielding solution for 5G mobile phone SIPs? The innovative, digital Heraeus system solution is more cost effective than all other available options. It covers consumable, equipment and digital process - all aligned by the experts in Printed Electronics.
Welco® AP5112 Water Soluble, Halogen-Free Solder Paste

Welco® AP5112 Water Soluble, Halogen-Free Solder Paste

For perfect compatibility, excellent wetting and unique powder properties which drastically lowers defects, provides better yield and comes with environment-friendly applications.
Microbond® DA5118D High Lead Dispensing Solder Paste

NEW! Microbond® DA5118 D High Lead Dispensing Solder Paste

Designed to meet the challenge of high density packaging assembly and demands of high volume production, DA5118 D exceptional dispensing performance enables long work life, low void rates coupled with easy cleanability. 

Join our experts presentations at EPTC 2019

Micro-interconnects: Signal integrity in 5G applications

05. December 2019, 2:05PM – 2:35PM
Location: 3813
Speaker: Dr. Sarangapani Murali
 more

Die attachment on bare Cu surface by non-pressure silver sintering in inert atmosphere

05. December 2019, 4:20PM - 5:40PM
Location: 3813
Speaker: Ly May Chew
 more

Enables Cu pillar flip chip attach with T7 lead-free solder paste

05. December 2019, 10:30AM – 11:15AM
Location: Jasmine Foyer
Speaker: B Senthil Kumar
 more

A new die attach material for high power electronic device

06. December 2019, 2:15PM – 3:15PM
Location: 3911
Speaker: Zhang Rui Fen
 more

Characterization of coating on fine interconnect materials

06. December 2019, 2:15PM – 3:15PM
Location: 3811
Speaker: Yam Lip Huei
 more