For memory packaging and next-generation material innovations, the microelectronics and semiconductor industries turn to Heraeus Electronics. Innovative materials solutions from Heraeus enable customers to develop new solutions for higher current density, addressing integration challenges and to answer the demand for improved reliability, miniaturization and cost efficiency.
Heraeus Electronics at IMAPS 2019
The Perfect Match - Heraeus Showcases Highly Efficient Materials & Solutions for Advanced Processes
Date: October 1st - 2nd, 2019
Product Highlights at IMAPS 2019
Heraeus High Temperature Heaters
Heraeus thick film heater materials provide you the solutions to meet demanding conditions with conductor, resistor, and insulating paste options. Materials sets are packaged upon substrate types and focus on the customers’ desired operating temperatures, heater specifications, and design requirements. Learn more about Heaters here
Further Product Highlights at IMAPS 2019
Join our expert presentation at IMAPS 2019
Laser Etching Gold for RF applications
2nd October between 4:30PM - 4:55PM
Speaker: Stephanie Edwards
As the industry grows there is a continuing trend for miniaturization in most packaging platforms. As a result Heraeus Electronics has put together an extensive Advanced packaging and SiP product portfolio to assist our customers in their continued growth. This product portfolio as well as the latest in Heater Solutions will be on display at the 52nd annual International Symposium on Microelectronics in Boston, MA. Please join the IMAPS organization and Heraeus Electronics at the conference to experience over 125 technical presentations and poster session on the most relevant topics in the industry.