PCIM Asia
Product Highlights at PCIM Asia for Power Electronic Applications
mAgic Sinter Pastes for high performance applications
Heraeus mAgic® Sinter Materials provides stable, powerful and lead-free option that could boost the lifetime of a device up to 10 times. This can be achieved through high-caliber thermal conductivity (>100W/mk), precise positioning of LED chips, a pressureless sintering process, and a decreased risk in voids.
The specialized array for pressure sintering mAgic PE338 (formerly ASP338) represents an expanded lifetime up to 10 times more in comparison to the standard solder in power cycling.
For non-pressure sintering applications, sinter mAgic DA295 (formerly ASP295) series is a lead-free alternate for high melting point solders.
Condura®: Heraeus Electronics presents high reliable ground conditions for your specific requirements
- Condura®.classic (DCB-Al2O3)
Time-tested standard for power electronic applications - Condura®.extra (DCB-ZTA)
Alumina DCB for more robustness to improve module reliability and processability - Condura®.prime (AMB-Si3N4)
Highest mechanical robustness and outstanding thermal conductivity - Condura®+
Choose your Plus out of 20 options to maximize your success in power electronics module production
DTS®: Get the most out of your power module with Heraeus Die Top System (DTS®)
You are interested to boost lifetime and power density in your power modules? Free yourself from the technical limitations of today’s standard and discover Heraeus Die Top System (DTS® ).
DTS® significantly improves the electrical, thermal and reliability performance of the die connection thus improving the whole module performance.
Heraeus Electronics Materials Solutions and Services for Packaging of Power Electronic Modules
Expert Presentation at PCIM Asia Forum
June 26th, 2019, Time TBA
Venue: Hall 2
Speaker: Tim Lu/ Segment Marketing Manager
Due to the continuous rise in the power density, coupled with higher operating temperatures and the demand for improved reliability, packaging materials are brought to the edge of their limits. The new Heraeus materials solutions enable the use of materials in combination with new technology. It significantly improves the electrical, thermal and reliability performance of the die connection, and effects the whole module performance. Additionally, it enables easy processing, improves the yields and helps to bring new packaging solutions faster to market.
