Shanghai

Heraeus Electronics at SEMICON China 2019

The Perfect Match - Heraeus Showcases Highly Efficient Materials & Solutions for Your Advanced Processes at Semicon China

For memory packaging and next-generation material innovations, the microelectronics and semiconductor industries turn to Heraeus Electronics. Innovative materials solutions from Heraeus enable customers to develop new solutions for higher current density, addressing integration challenges and to answer the demand for improved reliability, miniaturization and cost efficiency.

Meet our products and technical experts at SEMICON China

Date : March 20 to 22

Venue : Shanghai New International Expo Centre

Booth : #7459, Hall E7

Technology breakthrough: AgCoat™ Prime

A perfect substitute for gold wire in the memory market that the industry has been waiting for!

Gold Coated Silver Wire (AgCoat™)

Heraeus is the 1st in the world to showcase an innovative product that substitutes costly gold wires for memory packaging. Introducing AgCoat™ Prime – a gold coated silver wire which provides uncompromised reliability and workability with lowest cost of ownership.

Does size really matter?

System in Package

Layout and form factor are crucial for System in Package design. How to pack more components in a small package?

Join our game to find out and win prizes.

Other Product Highlights at SEMICON China

Welco® AP5112 Water Soluble, Halogen-Free Solder Paste

Welco® AP5112 Water Soluble, Halogen-Free Solder Paste

For significantly lower defects and better yield. Environmentally friendly.
Water Soluble Smartflux

Water Soluble Smartflux

This combination of high tacky fluxes and special solder powders significantly improves yields for high value packages and devices utilizing copper or tin metallizations.
mAgic Sinter Paste (Pressure and Non-Pressure)

mAgic Sinter Paste (Pressure and Non-Pressure)

Increase lifetime and thermal performance of your products with our mAgic® sinter paste.
Die Top System (DTS®) – Get the most out of your power module Substrate layout by courtesy of Fraunhofer IISB

Die Top System (DTS®) – Get the most out of your power module

DTS® significantly improves the electrical, thermal and reliability performance of the die connection thus improving the whole module performance.
Condura® – Metal Ceramic Substrates Portfolio from DCB to AMB

Condura® – Metal Ceramic Substrates Portfolio from DCB to AMB

Choose of 19 options to maximize your success in power electronics module production.
Condura®+ Alumina substrate with pre-applied solder

Condura®+ Alumina substrate with pre-applied solder

Up to 50 % less process steps for die soldering with our pre-soldered DCBs.