Heraeus at The Battery Show 2019

The Battery Show

The power electronics assembly market evolves at a fast pace, competition gets keener. Heraeus enables its customers to reach key targets for the development of their innovations by optimizing materials and materials combinations.

Meet our experts on the Battery Show 2019, which takes place on September 10-12, 2019 in Novi, MI. Heraeus booth is a must-see. Visit us at Booth #1636 to speak with our technical experts and learn more about our unique packaging solutions for the power electronics market.

Product Highlights at the Battery Show for Power Electronics

Th(INK) Heraeus for Automotive Heater Applications

Th(INK) for Heater Applications

Heraeus Thick Film Ink Heater systems provide automotive customers with the packages they need to outlast their competitors with a reliable solution. The Heraeus Thick film ink Heater solutions provide our customers with design flexibility, precision heating, power handling for high watt density, reliability in extreme environments, and low cost of ownership. With many operating temperatures up to 1000C, Heareus offers a reliable solution for all of your advanced automotive needs.

Condura®: Heraeus Electronics presents high reliable ground conditions for your specific requirements

 Heraeus Electronics presents its comprehensive portfolio of Condura® at PCIM Europe
  • Condura®.classic (DCB-Al2O3)
    Time-tested standard for power electronic applications
  • Condura®.extra (DCB-ZTA)
    Alumina DCB for more robustness to improve module reliability and processability
  • Condura®.prime (AMB-Si3N4)
    Highest mechanical robustness and outstanding thermal conductivity
  • Condura®+
    Choose your Plus out of 20 options to maximize your success in power electronics module production

DTS®: Get the most out of your power module with Heraeus Die Top System (DTS®)

Heraeus presents DTS on PCIM Europe Substrate layout by courtesy of Fraunhofer IISB

You are interested to boost lifetime and power density in your power modules? Free yourself from the technical limitations of today’s standard and discover Heraeus Die Top System (DTS® ).

DTS® significantly improves the electrical, thermal and reliability performance of the die connection thus improving the whole module performance.

mAgic Sinter Pressure Paste PE338 - Pressure Sinter on SIC

mAgic Sinter PE 338

Optimized for application with SIC power devices mAgic PE338 is a patented, pure Ag interconnect on bare copper surfaces.

mAgic Pressure sinter PE338 shows high thermal conductivity for operation temperatures up to 250 °C and is able to increase lifetime performance. With its high electrical conductivity it improves device efficiency. Since there are no flux residues, no cleaning required.

Interested in talking with our experts? Choose a schedule below to meet us at Battery Show 2019.

Trade show dates:

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