Join Heraeus Electronics Live Webinars
Die Top System (DTS®) – A competitive extension of mAgic® sintering
Date/Time: 4 May 2021/ 1:30 pm
Speaker: Andreas Hinrich, Team Lead Technology and Dr. Christophe Féry, Product Manager Material Systems
Power solutions for eMobility require miniaturization, energy efficiency and higher reliability. To cope with the increasing power density and operating temperature, more reliable die interconnection is required. Heraeus mAgic® sinter technology offers solutions for contacting both back- and frontside of the die. For the die top contacting, to keep benefiting from the flexibility of wedge bonding, which is the dominant interconnection technology in the electronic industry, Heraeus developed the Die Top System (DTS®) to enable the bonding of copper wires or ribbons.
Metal Ceramic Substrates (MCS) – Heraeus Electronics’ product family Condura® for your Power Electronics
Date/Time: 5 May 2021/ 1:30 pm
Speaker: Bastian Schlüter, Product Manager Metal Ceramic Substrates
Electrification and efficient power control in industrial and automotive markets are shaping up to display both the biggest potential and major challenges for the Power Electronics market. With a comprehensive portfolio of metal ceramic substrates, Heraeus Electronics addresses the diverse needs of the Power Electronics segment, ranging from low-power application up to the most demanding industries. The Condura® portfolio consists of Condura®.classic (DCB-Al2O3), Condura®.extra (DCB-ZTA), and Condura®.prime (AMB-Si3N4).
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