We apply digital power to meet you at the PCIM Europe digital days

PCIM Europe digital days will take place on 3 - 7 May 2021. ​

As an exhibitor and key sponsor, we invite you to join us for two live webinars addressing latest trends and challenges in the power electronics market. ​

​Register now and engage with our power electronics experts. ​

More information about PCIM Europe digital days


Join Heraeus Electronics Live Webinars

Die Top System (DTS®) – A competitive extension of mAgic® sintering​

Date/Time: 4 May 2021/ 1:30 pm​

Speaker: Andreas Hinrich​, Team Lead Technology​ and Dr. Christophe Féry, Product Manager Material Systems

Power solutions for eMobility require miniaturization, energy efficiency and higher reliability. To cope with the increasing power density and operating temperature, more reliable die interconnection is required. Heraeus mAgic® sinter technology offers solutions for contacting both back- and frontside of the die. For the die top contacting, to keep benefiting from the flexibility of wedge bonding, which is the dominant interconnection technology in the electronic industry, Heraeus developed the Die Top System (DTS®) to enable the bonding of copper wires or ribbons.


Metal Ceramic Substrates (MCS) – Heraeus Electronics’ product family Condura® for your Power Electronics​

Date/Time: 5 May 2021/ 1:30 pm​

Speaker: Bastian Schlüter​, Product Manager Metal Ceramic Substrates​

Electrification and efficient power control in industrial and automotive markets are shaping up to display both the biggest potential and major challenges for the Power Electronics market. With a comprehensive portfolio of metal ceramic substrates, Heraeus Electronics addresses the diverse needs of the Power Electronics segment, ranging from low-power application up to the most demanding industries. The Condura® portfolio consists of Condura®.classic (DCB-Al2O3), Condura®.extra (DCB-ZTA), and Condura®.prime (AMB-Si3N4). ​

Start to plan your visit:


NEW Product Highlights

Microbond PE830

Microbond® PE830 : Enabling High Yield for Die Attach Applications ​

Microbond® PE830 solder paste is designed for the use of die attach in power electronic modules. The revolutionary flux system incorporates synthetic resins that eliminate batch to batch variances and allows supply chain stability. As a result, the total cost of ownership (TCO) can be reduced through constantly high yield of sub-assemblies. These are realized by outstanding low void performance, low splashing rate as well as low die tilt and rotation. The product will be available with Tin-Silver alloy. In addition, the flux residues are easy to clean with standard cleaning agents.​

Key benefits​

  • Low batch to batch variance and supply chain stability through synthetic resin​
  • Outstanding low voids performance​
  • Minimal solder splashing​
  • Low tilt and rotation of dies ​
  • Good cleaning properties​
  • Reduction of total cost of ownership through high yield of production​

For more information on the trademark please click here

Interested in talking to our experts? Make an appointment to meet us at PCIM Europe digital days.

Trade show dates:

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