This year at SEMICON China, Heraeus will be showing the latest innovations to address new packaging challenges resulting from new end market applications such as 5G, Internet of Things (IoT) and Artificial Intelligence (AI).
Innovative materials solutions from Heraeus enable customers to develop new solutions for higher current density, addressing integration challenges and to answer the demand for improved reliability, miniaturization and cost efficiency. Partner with Heraeus to be one step ahead of the competition and bring next generation products faster to the market.
Visit our booth to learn more:
- Date : 17 March – 19 March
- Venue : Shanghai New International Expo Centre (SNIEC)
- Hall/ Booth : E7 | #7535