Continuing a Strong Bond

With Our Advanced Packaging Solutions For The Semiconductor Industry

Heraeus Electronics at SEMICON China 2021

This year at SEMICON China, Heraeus will be showing the latest innovations to address new packaging challenges resulting from new end market applications such as 5G, Internet of Things (IoT) and Artificial Intelligence (AI). 

Innovative materials solutions from Heraeus enable customers to develop new solutions for higher current density, addressing integration challenges and to answer the demand for improved reliability, miniaturization and cost efficiency. Partner with Heraeus to be one step ahead of the competition and bring next generation products faster to the market.

Visit our booth to learn more:

  • Date : 17 March – 19 March
  • Venue : Shanghai New International Expo Centre (SNIEC)
  • Hall/ Booth : E7 | #7535

For more information about SEMICON China

Semicon China floor plan

New product highlights at SEMICON China

Welco AP519 T6 Solder Paste for SiP Low Temperature Reflow

AP519

AP519 T6 solder paste is a low temperature, state-of-the-art no-clean, lead-free solder paste formulated with Heraeus proprietary Welco® powder. It is specifically designed for processes that require a low peak reflow temperature of ≤170°C, including BGA, SMD component or flip chip attach processes for fine pitch semiconductor packages such as System-in-Package (SiP), Package-on-Package (PoP) etc.​

Key benefits:

  • Low peak reflow temperature at 170 °C
    • Reduced thermal warpage of die and substrate
    • Reduced energy cost​​
  • Best-in-class low void performance
  • Consistent paste release at ultra-fine pitch (150um pitch - 100um stencil opening, 50um line spacing)
  • Minimal solder beading
  • Long stencil life & staging life
  • Welco difference – less batch-to-batch variations

Find out more


Welco® LED100 T7 No Clean Solder Paste for miniLED Die Attach

miniLED

LED100 T7 SAC305 is a state-of-art no-clean printing paste, specifically engineered for miniLED and microLED die attach applications. Paste release performance is exceptional at 70um stencil openings; and highly consistent over its stencil life. LED100 series use only Heraeus proprietary Welco® Type 7 powders to achieve low voids and high yield solder joints for customers’ applications.

Key benefits:

  • Best-in-class low void performance
  • Consistent paste release at ultra-fine pitch (120um pitch - 70um stencil opening, 50um line spacing)
  • Minimal solder beading
  • Long stencil life & staging life
  • Proven reliability and shear strength in miniLED application

Find out more

On Site Presentations

Day 1 - 3

Time Topic Speaker
10:20 – 10:40 Fabricated Quartz: HSQC Company and Main Products Introduction  Louis Liu | Technical Sales Manager More details
10:40 – 11:00 Prexonics® Semiconductor EMI Shielding Solution Jason Li | Sales Director More details
13:20 – 13:40 Addressing the Challenges of Ultra-Fine Pitch Advanced Packaging Applications with Heraeus Advanced Packaging Solutions Jorson Sun | Technical Solutions Engineer More details
13:40 – 14:00 AgCoat® Prime – An Alternative Solution to Gold Bonding Wire
Song Jian Bo | Bonding Wire Application Lab Supervisor More details
14:00 – 14:20 Accelerate your Packaging Development with Heraeus’ Advanced Engineering Services Zhang Jing | Head of Innovations China More details
14:20 – 14:40 Total Thermal Management Solution for Semiconductor from Heraeus Quartz Glass Golden Gu | Sales Director. More details


Meet our Experts!

Choose a schedule to meet us at SEMICON China.

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