Next Generation Material Solutions for Higher Reliability Power Modules
Heraeus Electronics at APEC 2022
The Applied Power Electronics Conference (APEC) will take place from 20- 24 March 2022 at Houston TX George R. Brown Convention Center.
The APEC focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference; APEC has something of interest for anyone involved in power electronics.
Heraeus Electronics is bringing its expertise for the Power Electronics industry to APEC in 2022. New applications like electromobility or renewable energy present enormous challenges for power electronics devices. With these new applications requirements are becoming more demanding as well. Temperatures up to 200ºC, durability requirements of more than 10 years, and everything as cost effective as possible you need a reliable partner to help you achieve these goals. Heraeus Electronics offers the systems know how to get the most out of your power module. Our team of dedicated engineers utilize our materials to create the best solution for your design with superior performance and cost in mind.
IS10.6 - Advanced Interconnection Technologies in Power Electronics for Improved Reliability and Performance
Date: Wednesday, March 23, 2022
Time: 11.05am - 11.30am
Speaker: Primary Industry Session Presenter(s) Habib Mustain, Business Segment Manager Power Electronics
Heraeus Electronics, a leading provider of material solutions for electronics packaging provides perfectly matched materials. This allows manufacturers to optimize performance and reliability of their products. Heraeus Electronics is the only company in the market that offers broader product portfolio for power electronics assembly – from bonding wires, sinter pastes to substrates and combining them to increase the performance of their power modules and assembly.
Die Top System (DTS®)
DTS® makes copper wire bonding possible without breaking the die and combines it with sinter technology. It significantly improves the electrical and thermal conductivity, the reliability of the die connection and optimizes the entire module performance. Its industrialization is straightforward thanks to the pre-applied sinter paste and the sintering of die and DTS® together in one process. Profiting from the flexibility of the wire bonding technology, the same production equipment can cover all layout variances. Altogether, DTS® maximizes profitability and helps to bring the next generation of power modules to market faster.
mAgic® PE338 : Pressure Ag Sinter Paste for Power Electronics Applications
Key requirements for power electronics and therefore for the interconnects on DCB substrates are increased lifetime, low thermal resistance and elevated operation temperature. mAgic® PE338 achieves best results with high thermal performance.
Improves device reliability
High thermal conductivity for longer lifetime
High electrical conductivity improves device efficency
Enables high operating temperature
Lead-free and halogen zero formulation for environmental compliance
PowerCu Soft : Copper Power Bonding Wires and Ribbons
The outstanding properties of large-diameter copper bonding wires and ribbons from Heraeus' PowerCu Soft family let you solve many technical challenges in electronics applications while at the same time reducing costs.
Replace up to 3 single wires (UPH improvement)
Higher power density
Advanced mechanical and electrical properties
Able to resist high temperature and mechanical stress
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