Next Generation Material Solutions for Higher Reliability Power Modules

Heraeus Electronics at APEC 2022

The Applied Power Electronics Conference (APEC) will take place from 20- 24 March 2022 at Houston TX George R. Brown Convention Center.

The APEC focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference; APEC has something of interest for anyone involved in power electronics.

Heraeus Electronics is bringing its expertise for the Power Electronics industry to APEC in 2022. New applications like electromobility or renewable energy present enormous challenges for power electronics devices. With these new applications requirements are becoming more demanding as well. Temperatures up to 200ºC, durability requirements of more than 10 years, and everything as cost effective as possible you need a reliable partner to help you achieve these goals. Heraeus Electronics offers the systems know how to get the most out of your power module. Our team of dedicated engineers utilize our materials to create the best solution for your design with superior performance and cost in mind.

Heraeus Electronics Solutions

Aluminum bonding ribbons, aluminum bonding wires, copper wires, aluminum cladded wire, Microbond® solder pastes, mAgic® pressure sinter paste, mAgic® non-pressure sinter paste, Condura® metal ceramic substrates and terminals/leadframes.

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More information about APEC 2022

Join Heraeus Electronics's Expert Presentation

IS10.6 - Advanced Interconnection Technologies in Power Electronics for Improved Reliability and Performance

Date: Wednesday, March 23, 2022

Time: 11.05am - 11.30am

Location: ​320C

Speaker: Primary Industry Session Presenter(s) Habib Mustain, Business Segment Manager Power Electronics

Heraeus Electronics, a leading provider of material solutions for electronics packaging provides perfectly matched materials. This allows manufacturers to optimize performance and reliability of their products. Heraeus Electronics is the only company in the market that offers broader product portfolio for power electronics assembly – from bonding wires, sinter pastes to substrates and combining them to increase the performance of their power modules and assembly.

Product Showcase

Microbond PE830
Substrate layout by courtesy of Fraunhofer IISB

Die Top System (DTS®)

DTS® makes copper wire bonding possible without breaking the die and combines it with sinter technology. It significantly improves the electrical and thermal conductivity, the reliability of the die connection and optimizes the entire module performance. Its industrialization is straightforward thanks to the pre-applied sinter paste and the sintering of die and DTS® together in one process. Profiting from the flexibility of the wire bonding technology, the same production equipment can cover all layout variances. Altogether, DTS® maximizes profitability and helps to bring the next generation of power modules to market faster.

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More products at the show