Date: 1 – 3 December 2021
Conference register link: https://www.conftool.org/eptc2021/
Let Heraeus Electronics unlock your potential
Meet Heraeus Electronics - at the 23rd Electronics Packaging Technology Conference 2021 (virtual)
We cordially invite you to join our presentations to learn more about the latest mega trends driving the next generation electronics and semiconductor industry. Listen to our experts as they unfold latest innovative solutions Heraeus offers to meet your challenges and keep you ahead of the competition.
Join our expert's presentations
Packaging Materials as a Key Enabler for Future Megatrends
Date: 2 December 2021
Time: 3 - 4pm
Session: Technology Talk 6
Presenter: Dr. Klemens Brunner, President of Heraeus Electronics
Abstract:
5G Communications, Renewable Energy Generation and Electric Vehicles are megatrends that not only impact our daily lives, but also bring significant changes to the entire electronics semiconductor packaging industry. Continuous miniaturization of semiconductor devices requires more advanced packaging to deliver better electrical performance, smaller footprint and higher reliability. Heraeus Electronics will discuss how materials innovations enable such requirements through breakthroughs in packaging of devices and address the various technology challenges, from ever-shrinking interconnects for System-In-Package (SiP), to stringent reliability requirements for Power & Automotive electronics.
Fine-Pitch Microdots Dispensing and Jetting Optimization in SiP Assembly using Welco® Solder Paste
Date: 1 - 31 December 2021
Session: Assembly Materials and Processing 1 (24/7 on-demand video)
Presenter: Mr. Donald Nantes, Senior Technical Solutions Engineer
Abstract:
With the massive advancement in heterogeneous SIP integration, today’s industry required microscopic dispensations with greater accuracy and consistency requirements for MEMS cavity or 3D-mid soldering application which are integrated into the SIP assembly. Solder paste dispensing has been used for decades and it offers better flexibility by allowing dispensed solder into cavities and on top of the mounted components. Lines and irregular dispense patterns are also achievable using this method. The main drawback is the relatively slow speed at which solder paste can be dispensed when compared to screen printing. 3D screen printing has its own limitation in terms of stencil fabrication and paste deposition consistency at narrow pitch though it offers higher throughput. With the recent breakthrough in the microdots dispensing technology, fine pitch and high accuracy paste dispensing can be achieved without splashing and significantly reduces deposit satellites in acceptable tolerances. Solder paste jetting can be considered a viable option other than dispensing. It is a non-contact dispensing fluid application where the transfer of momentum is through high accelerations and resulted in fixed volume amount by controlling the material fed into a chamber. It also enables multiple pass possibilities to customize solder paste deposits other than single dot variation. Customization can be done for volume, paste height, shape, position, and pad coverage.
In terms of material perspective, the paste rheology is critical for both dispensing and jetting application. Stable and constant shear viscosity over time is crucial in ensuring consistent dispensability without defects using Type 6, 7 and even Type 8 powders. Adjusting the metal load helps to improve the paste fluidity flow rate but adverse effect will be less actual solder amount formation after soldering. This paper will study the effect of dispensing parameters on dispensability performance over time at fine apertures as well as needle gauge size configuration with response to the powder size used.