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with Matched Materials Solutions from Heraeus Electronics

Heraeus Electronics at PCIM Asia 2021

The power electronics assembly market evolves at a fast pace, and competition becomes more intense. The power semiconductor industry is undergoing a technology revolution, led by Wide Band-gap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN), to enable higher power densities and switching frequencies. However, these challenges and requirements cannot be met by the prevailing power electronics packaging technologies and solutions, which have become a bottleneck to achieve the best result in WBG semiconductors. Therefore, the next-generation packaging materials and matched solutions are key to the WBG-enabled transformation. With Heraeus Electronics, customers reach key targets for the development of their innovations by optimizing materials and matched materials combinations.

  • Exhibition date: 9 - 11 September 2021
  • Heraeus Booth No. Hall 11, Booth #D42
  • Venue: Hall 11, Shenzhen World Exhibition & Convention Center

 More information about PCIM Asia 2021

Product Highlights at PCIM Asia for Power Electronic Applications

Condura.prime – AMB Si3N4 Substrates

Key Benefits

  • Increased life time due to highest reliablity
  • Improved power density
  • Lower thermal resistance
  • Proven increased mechanical robustness
  • Improved heat dissipation

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Condura.extra- DBC-ZTA

  • Robustness enhancement through Zr doped Al2O3
  • Higher reliability compared to Condura®.classic (Al2O3) standard products
  • Mainly used in the medium power segment for advanced industry applications or power electronics for automotive

Die Top System

  • Die current capability increases > 50% vs. aluminium wire
  • 50x longer lifetime vs. solder die attach and Al-wire on system level.
  • Enables higher junction temperatures of more than 200°C
  • Superior robustness vs. other solutions (e.g. clips)

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Condura+ with Pre-applied Solder

Key Benefits
  • 50 % fewer process steps for die soldering
  • Production cost savings - Lower investment in equipment and cleaning materials
  • Improved yield

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PowerCu Soft

Key Benefits
  • Optimal bondability due to extreme softness and minimal resistance to deformation
  • Uniformly fine grain structure
  • Extremely high thermal stability
  • Minimal electrical resistivity

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CucorAl PLUS Bonding Wire

Aluminum Cladded Copper Wire for Power Application

  • Increased reliability compared to standard aluminum material
  • Compatibility with standard bonding and standard
  • Chip technology
  • Superior electrical and thermal capabilities
  • Outstanding power cycling performance

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mAgic PE338

  • Pressure Sinter Paste
  • Optimized for SiC application

Key Benefits

  • Sinters on bare copper surface
  • Improved mechanical properties for higher reliability
  • Enables high operating temperature up to 250 °C

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mAgic DA295A

Non-Pressure Sinter Paste for Power Semiconductor application

  • Improves heat dissipation to enable operation at elevated temperature
  • Low temperature processing at 200 ⁰C
  • Improves open time performance for wider processing window

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Expert Presentation at PCIM Asia Forum

Advanced Packaging Solutions for SiC Based EV Inverter System

  • Date: 9th September 2021, 15:10 - 15:30
  • Venue: Hall 11, Shenzhen World Exhibition & Convention Center
  • Topic: Advanced Packaging Solutions for SiC Based EV Inverter System
  • Speaker: Dr. Jing Zhang, Director of innovation China, Heraeus Electronics

Power solutions for eMobility require miniaturization, energy efficiency and higher reliability. These requirements accelerated SiC power device adoption in many applications to enable higher power densities and switching frequencies. Therefore, it is important to develop suitable packaging materials and solutions to maximize the benefit of such device to cope with its increasing power density and operating temperature. Moreover, reduced parasitic inductance and maximized system reliability are also the key requirements. In this presentation, Heraeus Electronics will provide a full packaging solution for SiC power devices adopting novel packaging materials, including silver sinter materials, high reliability metal ceramic substrate and Die Top System (DTS). We will further show how and to what extent this solution can maximize the packaging performance.

Interested in talking to our experts? Make an appointment to meet with us at PCIM Asia

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