Heraeus Electronics to Showcase New Pastes and SMT Customer Applications Lab at Surface Mount Technology Association International (SMTAi) Conference & Exhibition, September 19-20

WEST CONSHOHOCKEN, PA- September 19, 2017

Water-Soluble Fine Pitch Solder Paste and mAgic® Sinter Pastes deliver greater reliability, performance & extended lifetime in demanding environments.

Water-Soluable Fine Pitch Solder Paste WS 5112

Heraeus Electronics, a leading provider of materials solutions for the semiconductor and electronic packaging industries, announced they will showcase two new pastes and its new SMT Customer Applications Lab at the Surface Mount Technology Association International (SMTAi) Conference & Exhibition, September 19-20, at the Donald Stephens Convention Center in Rosemont, Illinois. As the world’s first company to commercially produce zero-splatter paste, the pastes featured at SMTAi reflect the commitment of Heraeus Electronics to provide even greater performance for customers.

Heraeus Electronics WS5112 solder paste is the latest innovation in water-soluble solder pastes to provide unparalleled performance in demanding processes and applications. Designed to reduce defects and improve yield, WS5112 is a water-soluble, halogen-free paste that has zero-splattering (splashing) and long staging life due to its excellent rheological properties, offering superior fine pitch printing performance. WS5112 flux platform can support various alloys and powder types up to Type 7. Additionally, the paste produces minimal, easily cleanable residues while providing excellent wetting.

The Heraeus Electronics mAgic® non-pressure Sinter Paste lives up to its name to work like magic to improve lifetime and thermal performance of power packages and power electronics. Developed as a lead-free, Halogen Zero formulation, the ASP295-09P9 mAgic® Sinter Paste is an effective die-attach solution for segments such as power discrete, HP LED and RF power devices. The paste series delivers significant benefits, including:

  • Low sintering temperature at 200 ºC
  • Improved thermal conductivity compared to solder paste for applications requiring higher thermal dissipation
  • Reduced processing costs, as no flux cleaning after processing is required

In addition to the pastes, Heraeus Electronics will be offering conference attendees with “virtual tours” of its new SMT Customer Applications Lab, which was recently opened at the company’s West Conshohocken, PA location. The multi-million dollar investment provides customers with a fully-functional SMT assembly line that can be utilized to optimize processes, collaborate on product development and conduct trouble-shooting on industry issues. A variety of testing can be done, including: product/process defect analysis; scanning electron microscopy with energy dispersive x-ray; fourier transform infrared spectroscopy; thermo gravimetric analysis; differential scanning calorimetry; die-penetration testing, cross-sectioning, CT x-ray; pull and sheer testing, wire-bond testing; stress and strain analysis; and cross-sectioning and analysis.

According to David Malanga, Head of Sales for the Americas Region, one of the lab’s most important features is the climate-controlled clean room. He said, “Paste customers have unique manufacturing environments, and it is important to do testing and analysis in those same exact conditions. By adjusting and matching their climate in our lab, we can help customers optimize processes and develop products to meet their applications.”

Heraeus Electronics will be exhibiting at the 2017 Surface Mount Technology Association (SMTAi) International Conference & Exhibition, September 19-20 at the Donald Stephens Convention Center in Rosemont, Illinois. For more information about this event and Heraeus Electronics, please visit www.heraeus-electronics.com

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