We inform you regulary about latest Heraeus Electronics news. Learn more about the developments around our products. Please feel invited to contact our experts directly.
At the 2018 SMT Hybrid Packaging event in Nuremberg, Mark Challingsworth, Global Head of Marketing for Hereaus Electronics, gives a quick preview of upcoming products and innovations.
Heraeus Electronics showcases the new premium metal ceramic substrate Condura.prime (AMB-Si3N4).
The certification underlines the commitment made by Heraeus to ensure the highest quality standards for automotive customers worldwide.
Mark Challingsworth explains what companies should focus on in order to succeed with today’s trends and what is yet to come. He also further discusses the developments and what the future of the company will look like.
A wide range of new products are displayed at the Heraeus booth at Semicon China addressing the needs of the semiconductor industry in order to develop solutions with fast, efficient and reliable production processes.
Innovative sinter pastes optimized for high-power LEDs, including vertical chips, flip chips and CSPs
Integrated product line of materials, components and services to provide a single supplier solution for LED manufacturers
Customers to benefit from larger sinter paste product portfolio.
Technology will enable Heraeus to develop a new platform of thick film pastes for ultrafine features, furthering device performance and miniaturization.
No-clean soldering pastes from Heraeus reduce energy consumption by up to 40 percent and contribute to lower costs in the production of electronic modules.
Water-Soluble Fine Pitch Solder Paste WS5112 and mAgic® Sinter Pastes deliver greater reliability, performance & extended lifetime in demanding environments.
Innovative new WS5112 Water-soluble Fine Pitch Solder Paste and mAgic® Sinter Pastes to be showcased at Semicon Taiwan Show, September 13th to 15th
Heraeus announced the opening of its new SMT Applications Lab at the company’s facility in West Conshohocken, PA.
• The Hanau materials specialist delivers intricate roll-clad strips for the expansion of CERN’s Large Hadron Collider
DCB+ substrates with pre-applied solder reduce process steps for chip assembly by 50 percent
Dramatic 4x conductivity achieved over current commercially available carbon graphite inks.
Cooperation agreement concluded with Danfoss. The Die Top System is developed from Danfoss Bond Buffer® technology.
Company to share its latest advancements packaging materials to improve performance in micro and power electronics.
Heraeus announced today it will demonstrate the robust durability of its Thick Print Copper Paste System, along with its full line of materials for power circuits, at the Applied Power Electronics Conference (APEC).
The Global Semiconductor & Electronics Forum (GSEF), 11-13 March 2015 Shanghai (China), offers Heraeus a unique experience getting to know industry leaders.
Heraeus Electronics, a world leader in electronic packaging materials and technology, will unveil CoolStrates™, a new line of circuit boards made with Celcion™ Thick Film Paste at Strategies in Light 2015.
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