We inform you regulary about latest Heraeus Electronics news. Learn more about the developments around our products. Please feel invited to contact our experts directly.
SMT Today interview Jim Wertin at APEX 2019 to discuss Heraeus Microbond SMT 650 Solder Paste
The new Microbond® SMT650 solder paste developed by Heraeus Electronics achieves a consistently high surface resistance.
Heraeus Electronics has opened a new Innovation Center in Shanghai to develop and test material systems. The facility assembles chips as well as solder and test components for customers.
SMT Today interview Manu Noé Vaidya at SMTAi 2018 to discuss all the latest news from Heraeus
Heraeus has developed a new thick film gold conductor paste that avoids lead and cadmium. Specially matched ingredients also ensure a denser fired film and excellent bond strength with the ability for etching
As LEDs continue to shrink in size, there is a need for materials that dissipate heat quickly and solutions to ensure the effective electrical connection of micro LEDs. At the International LED professional Symposium 2018, Heraeus shows how this can be achieved
In this interview, Stefan Mausner, LED expert at Heraeus Electronics, discusses the future development of the LED market as well as major trends
SEMICON Taiwan: Li-San Chan, Global Product Manager at Heraeus Electronics, explains which solder paste is the right choice for which application and how manufacturers can avoid production line delays and package defects.
New Water Soluble Ultra Fine Pitch Solder Paste significantly reduces defects for system-in-package manufacturers
Heraeus Electronics presents a new system for chip-top contacting in power electronics modules at the PCIM Asia conference in Shanghai from June 26 to 28, 2018.
At the 2018 SMT Hybrid Packaging event in Nuremberg, Mark Challingsworth, Global Head of Marketing for Hereaus Electronics, gives a quick preview of upcoming products and innovations.
Heraeus Electronics showcases the new premium metal ceramic substrate Condura.prime (AMB-Si3N4).
The certification underlines the commitment made by Heraeus to ensure the highest quality standards for automotive customers worldwide.
Mark Challingsworth explains what companies should focus on in order to succeed with today’s trends and what is yet to come. He also further discusses the developments and what the future of the company will look like.
A wide range of new products are displayed at the Heraeus booth at Semicon China addressing the needs of the semiconductor industry in order to develop solutions with fast, efficient and reliable production processes.
Innovative sinter pastes optimized for high-power LEDs, including vertical chips, flip chips and CSPs
Integrated product line of materials, components and services to provide a single supplier solution for LED manufacturers
Customers to benefit from larger sinter paste product portfolio.
Technology will enable Heraeus to develop a new platform of thick film pastes for ultrafine features, furthering device performance and miniaturization.
No-clean soldering pastes from Heraeus reduce energy consumption by up to 40 percent and contribute to lower costs in the production of electronic modules.
Water-Soluble Fine Pitch Solder Paste WS5112 and mAgic® Sinter Pastes deliver greater reliability, performance & extended lifetime in demanding environments.
Innovative new WS5112 Water-soluble Fine Pitch Solder Paste and mAgic® Sinter Pastes to be showcased at Semicon Taiwan Show, September 13th to 15th
Heraeus announced the opening of its new SMT Applications Lab at the company’s facility in West Conshohocken, PA.
• The Hanau materials specialist delivers intricate roll-clad strips for the expansion of CERN’s Large Hadron Collider
DCB+ substrates with pre-applied solder reduce process steps for chip assembly by 50 percent
Dramatic 4x conductivity achieved over current commercially available carbon graphite inks.
Cooperation agreement concluded with Danfoss. The Die Top System is developed from Danfoss Bond Buffer® technology.
Company to share its latest advancements packaging materials to improve performance in micro and power electronics.
Heraeus announced today it will demonstrate the robust durability of its Thick Print Copper Paste System, along with its full line of materials for power circuits, at the Applied Power Electronics Conference (APEC).
The Global Semiconductor & Electronics Forum (GSEF), 11-13 March 2015 Shanghai (China), offers Heraeus a unique experience getting to know industry leaders.
Heraeus Electronics, a world leader in electronic packaging materials and technology, will unveil CoolStrates™, a new line of circuit boards made with Celcion™ Thick Film Paste at Strategies in Light 2015.
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