Condura^{^®}+

Services beyond the product: Choose your PLUS to maximize your success in power electronics module production.

Heraeus offers with its Condura^®+ a comprehensive portfolio of features and services to functionalize your substrates, simplify your process, enhance your productivity and support your product development cycle.

Condura®+
Property Plus
Option Plus
Processing Plus
Service Plus

Choose your PLUS

Choose of 19 options to maximize your success in power electronics module production:

Property plus
Option plus
Service plus
Processing plus

Choose your PROPERTY PLUS

Ceramic thickness: Different thicknesses available, depending on the ceramic type
Customized warpage: Master card with tuned warpage in direction and amplitude
Copper thickness: Different thicknesses available, depending on the ceramic type
Surface finish:
- Cu
- Ni
- NiAu
- Ag
- Brushing
Laser scribing for singulation: Innovative laser process which eliminates material residues
Customized dimples: For stress relief in Condura^®.classic and Condura^®.extra

Choose your OPTION PLUS

Burr-free holes (Laser cut-out): Innovative laser cutting process for burr-free holes
Data Matrix Code: Continuous traceability
Automated Optical Inspection (AOI): Implement high level QA procedure
Ultrasonic testing: Non destructive control of the interface between copper and ceramic
Customized packing: Customer specific packing

Choose your PROCESSING PLUS

Pre-applied solder
- No more solder paste printing & flux cleaning
- Take responsibility through pre-applied material system
- Reduce yield losses
- Process simplification
- No solder stop (dimples or solder mask)
Read more: Condura^®+ alumina substrate with pre-applied solder
Pre-applied sinter paste
- No more sinter paste printing & drying
- Take responsibility through pre-applied material system
- Reduce yield losses
- Process simplification
- Reduces costs

Choose your SERVICE PLUS

Matching materials: Select matched joining materials
Design: Layout of conductive layers, die and components placement
Thermal simulation: Simulation of temperature distribution e.g. for hot spot prediction
Prototyping:
- Module prototyping and metal ceramic substrates assembly
- Functional prototypes for metal ceramic substrates validation
Active power cycling: Testing of power modules or assembled metal ceramic substrates
Testing: Tests on bare or assembled metal ceramic substrates
Analytics:
- Failure analysis
- Analysis of functional surfaces

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