Condura^®+

Choose of 19 options to maximize your success in power electronics module production:

• Property plus
• Option plus
• Service plus
• Processing plus

• Ceramic thickness: Different thicknesses available, depending on the ceramic type
• Customized warpage: Master card with tuned warpage in direction and amplitude
• Copper thickness: Different thicknesses available, depending on the ceramic type
• Surface finish:
  
  • Cu
  • Ni
  • NiAu
  • Ag
  • Brushing
• Laser scribing for singulation: Innovative laser process which eliminates material residues

• Burr-free holes (Laser cut-out): Innovative laser cutting process for burr-free holes
• Data Matrix Code: Continuous traceability
• Automated Optical Inspection (AOI): Implement high level QA procedure
• Ultrasonic testing: Non destructive control of the interface between copper and ceramic
• Customized packing: Customer specific packing

• Pre-applied solder
  
  • No more solder paste printing & flux cleaning
  • Take responsibility through pre-applied material system
  • Reduce yield losses
  • Process simplification
  • No solder stop (dimples or solder mask)
  Read more: Condura^®+ alumina substrate with pre-applied solder
  
  
  
• Pre-applied sinter paste
  • No more sinter paste printing & drying
  • Take responsibility through pre-applied material system
  • Reduce yield losses
  • Process simplification
  • Reduces costs

• Matching materials: Select matched joining materials
• Design: Layout of conductive layers, die and components placement
• Thermal simulation: Simulation of temperature distribution e.g. for hot spot prediction
• Prototyping:
  • Module prototyping and metal ceramic substrates assembly
  • Functional prototypes for metal ceramic substrates validation
• Active power cycling: Testing of power modules or assembled metal ceramic substrates
• Testing: Tests on bare or assembled metal ceramic substrates
• Analytics:
  • Failure analysis
  • Analysis of functional surfaces