Condura®+
Choose your SERIVCE PLUS

Service Plus
  • Matching materials
    Select matched joining material
  • Design
    Layout of conductive layers, die and components placement
  • Thermal simulation
    Simulation of temperature distribution e.g. for hot spot prediction
  • Prototyping:
    • Module prototyping and metal ceramic substrates assembly
    • Functional prototypes for metal ceramic substrates validation
  • Active power cycling
    Testing of power modules or assembled metal ceramic substrates
  • Testing
    Tests on bare or assembled metal ceramic substrates
  • Analytics:
    • Failure analysis
    • Analysis of functional surfaces

Your Contact for Heraeus Electronics

Heraeus Electronics


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