High power applications and rising customer expectations put pressure on the reliability, thermal performance and lifetime of metal ceramic substrates. Thermal and mechanical fatigue defects in electronic components are primarily caused by successive on/off cycling. To maximize reliability, engineers must identify the optimal combination of material performance and properties.
Silicon nitride (Si3N4) offers excellent mechanical properties (high bending strength, high fracture toughness) and a high thermal conductivity (> 80 W/m∙K). The outstanding mechanical robustness of Si3N4 enables brazing with thick Cu layers (up to 800 µm) offering additional thermal capacity to dissipate load peaks. Thus baseplates become obsolete for certain applications.
AMB-Si3N4 substrates combine best mechanical robustness with excellent heat dissipation properties featuring very high power densities. Optimal performance and reliability can be achieved by using silver sintering, Die Top System (DTS®) and Cu bonding technology. This setup also enables utilizing the full potential of wide bandgap (WBG) semiconductors (SiC, GaN).
For your specific needs, we identify the optimal material combination from our broad product portfolio: metal ceramic substrates with functional surfaces optimized for our sintering, soldering and bonding solutions.