miniLEDs are increasingly being used in backlights or displays for consumer products such as tablets, TVs, or videowalls. Its small die sizes bring huge benefits in finer resolution, higher brightness, better contrast, longer worklife traditional LEDs or other display technologies. At the same time, being extremely small in sizes also present tremendous challenges for miniLED die attach materials and processes.
For the attach of miniLED dies onto substrates, solder paste materials have to be printed consistently and accurately onto extremely small substrate pads of <100um. This is only achievable with Welco® LED100 Type 7 paste. Paste release performance is exceptional at 70um stencil openings and highly consistent over its long stencil life.
Welco® LED100 series uses Heraeus proprietary Welco® Type 7 powders to achieve highly reliable solder joints- consistent solder volume without bridging or missing dots, best-in-class low void performance, and most importantly proven reliability (TCT, shear strength, etc.) performance for real miniLED applications.