Welco® LED120: T7 SAC305 No-Clean Printing Paste

Engineered primarily for mini and microLED die attach applications for products like tablets, TVs, or videowalls.

mini and micro LED

Given higher resolution, enhanced brightness, better contrast, and longer work life compared to traditional LEDs or other display technologies, mini and microLEDs are increasingly used in backlights or displays for consumer products such as tablets, TVs, or videowalls. To provide premium performance, quality, and reliability, miniLED die attach materials and processes must overcome challenges as defined by the extremely small die size.

The new Welco® LED120 Type 7 paste is especially engineered to print consistently and accurately onto extremely small substrate pads of <100µm to attach miniLED dies. The paste release performance is exceptional at 70µm stencil openings and highly consistent over its long stencil life.

Welco® LED120 series uses Heraeus proprietary Welco® Type 7 powders to enable extremely reliable solder joints - consistent solder volume without bridging or missing dots, best-in-class low void performance, and most importantly, proven reliability (e.g. shear strength) for mini and microLED applications.

Key Features

  • Incorporates high-quality Welco® T7 SAC305 powders
    • Narrow size distribution
    • Uniform spherical shapes
    • Batch-to-batch consistency
  • Halogen-free and No-clean chemistry
  • Best-in-class low-void performance
  • Minimal solder beading
  • Consistent fine pitch paste release
  • Long stencil life (≥10hr) & staging life (≥10hr)
  • Proven reliability and shear strength in miniLED application

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