Advanced Packaging Solder Pastes (System in Package)

Continued miniaturization and the incorporation of 3D integrated modules increase the complexity and functionality of packages. Heraeus System in Package (SiP) solder pastes meet the high requirements of fine pitch applications with especially designed advanced compatibility.

Advanced Packaging Solder Paste

Electronic devices are getting continually smaller and more chip functions are integrated into smaller packages. For the solder process pastes with very fine powders are needed. As components and flip-chips gets more densely packed, chemistry compatibility between solder materials is crucial.

Furthermore, cycle times are getting shorter. Robust solder materials enable customers to use a “plug and play” mode to reduce development cycle time significantly.

Heraeus advanced packaging products are using type 5 to type 8 fine powders, produced with the Heraeus proprietary Welco technology that results in unique powder properties: Superior quality and sphericity of Welco® powders enable fine pitch applications down to 80 µm.

The unique compatibility of the System in Package involving WS5112, Smartflux, SOP92131 and SOP92132 come with similar reflow profiles without splashing or solder loss issues. Products are available halogen-free, zero-halogen or halogen-containing depending on your requirements.

Our manufacturing locations spread across the world in Romania, Singapore and China support your solder materials needs. Save time and money with Heraeus as a qualified partner and accelerate your process.

Your benefits at a glance:

  • Perfect compatibility due to matched system of all solder components for best soldering results on very fine pitch applications
  • Excellent wetting properties for high reliable solder connections
  • Minimal residue remaining after cleaning for perfect results
  • Unique powder properties with superior quality and sphericity due to Welco® technology for best ultra-fine pitch applications
  • Long stencil life for a wide process window for seamless manufacturing

Your benefits in working with Heraeus:

  • Pretested solutions due to our in-house application centre
  • Exactly the right solution for your application, adapted to your needs

Automotive:

  • Infotainment
  • Cameras
  • Sensors
  • GPS

Communications:

  • Wireless
  • Wired
  • Satellite
  • RF devices

Consumer Electronics & Computing:

  • Smartphones & mobile phones
  • PCs
  • Tablets
  • Smart TVs
  • Servers & systems
  • Imaging devices
  • Wearable electronics
  • Smart home appliances

Water Soluble Solder Paste

Our halogen-containing F541 (HBF) and F510 series are well-established water soluble solder pastes. New halogen-free products include F590 and WS5112 series. They support Type 3 to Type 6 powders. WL449 series is a zero-halogen solder paste that supports Type 3 and Type 4 powders.

Fluxes and Smartflux

Smartflux is a low metal content water soluble solder paste for flip chip attach applications that is suitable for both solder bumps and copper pillar with tin-copper caps. Only available in Welco Type 6 powder, Heraeus offers both halogen-free Smartflux FLX89161 and halogen-containing Smartflux FLX89131. Smartflux can be applied using pin transfer or dipping techniques.

No Clean Solder Paste

For no clean solutions Heraeus offers halogen-free SOP92131 Type 3 to Type 6 for printing applications and SOP92132 Type 3~Type 5 for dispensing applications.

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