Electronic devices are getting continually smaller and more chip functions are integrated into smaller packages. For the solder process pastes with very fine powders are needed. As components and flip-chips gets more densely packed, chemistry compatibility between solder materials is crucial.
Furthermore, cycle times are getting shorter. Robust solder materials enable customers to use a “plug and play” mode to reduce development cycle time significantly.
Heraeus advanced packaging products are using type 5 to type 8 fine powders, produced with the Heraeus proprietary Welco technology that results in unique powder properties: Superior quality and sphericity of Welco® powders enable fine pitch applications down to 80 µm.
The unique compatibility of the System in Package involving WS5112, Smartflux, SOP92131 and SOP92132 come with similar reflow profiles without splashing or solder loss issues. Products are available halogen-free, zero-halogen or halogen-containing depending on your requirements.
Our manufacturing locations spread across the world in Romania, Singapore and China support your solder materials needs. Save time and money with Heraeus as a qualified partner and accelerate your process.