Heraeus Celcion® is a thick film materials system designed to build circuits on aluminum substrates.
Traditionally, MCPCBs are constructed using a subtractive process, adding then removing material. This takes time and often wastes costly material.
Celcion®, however, incorporates a selective additive deposition process flow—using material only where it's needed. The result is reduced processing steps, less material consumption and simplified bill of materials. Quick and inexpensive design changes can be made. It's an innert glass/metal system - no flammability issues.
Celcion® is compatible with Pb-free solders and fine Au wire bonding. The material is Pb-free, RoHS compliant, REACH compliant.
Heraeus offers with its Celcion® is a thick film based material system, consisting of insulating, conductor, covercoat, and resistor pastes to build circuits directly onto aluminum substrates. All materials can be fired at less than 600 ºC, and it is compatible with 3000, 4000, 5000 and 6000 series aluminum substrates.
Its unique glass system minimizes bowing on aluminum while providing increased thermal conductivity and high dielectric break down strength.