Heraeus offers a wide range of pastes for thick film circuits, such as gold, silver, palladium, platinum or copper conductive pastes. Dielectrics, overglazes and resistive pastes complete the line of Heraeus products for hybrid applications.
These recommended pastes meet current environmental demands, such as RoHS, by offering Pb, Cd, and Ni free formulations. Specific formulations for plateable, solderable and wire bondable applications make up the range of commercially available products.
Principal processing steps are:
- screen printing on temperature resistant ceramic substrates
- leveling and drying
- firing between 500 °C and 1200 °C, typically at 850 °C