• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: MLCC
  • Metal: AgPd
  • Application: Buried Electrode
  • Description: The Ag/Pd powders contained in these pastes are alloyed, micro-fine particles. The organic system has been developed to be compatible with a wide range of tape systems. The pastes can also be customized with customer specific inorganic additives to minimize shrinkage mismatch and optimize electrical properties.
  • Key features: BT based dielectrics
  • Process Temperature: 1115-1130°C peak temperature.
  • Viscosity: 30-35 Kcps, Brookfield RVT Spindle #14 at 10 rpm, 25°C
  • Solids: 55% ± 1%
  • Alloy Ratio: 70:30:00

Discuss your solution

Talk to our experts and find the optimal solution for your applications.