• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: AgPd
  • Application: Hybrid IC
  • Description: C2130B is a Pd/Ag composition designed for applications where more leach resistance is required. The C2130B conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial circuits where more stringent requirementsexist. It exhibits excellent solderability, aged adhesion and is aluminum wire bondable.
  • Key features: Excellent solderability and leach resistance#Excellent long term adhesion#Good AI wire bond adhesion (initial and aged)
  • Process Temperature: 850 °C peak temperature. 10 minutes at peak. Total cycle time 30-60 minutes.
  • Film Thickness : 10-15 um
  • Viscosity: 180 -280 Kcps Brookfield HBTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Conductivity: ≤ 35 milliohms/square at 12 um fired film thickness
  • Solids: 79.0 ± 1.0 %
  • Alloy Ratio: 03:01

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