C4082

C4082
  • Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: AgPtPd
  • Application: Hybrid IC
  • Description: C4082 is a Ag/Pd/Pt formulation which provides outstanding leach resistance and aged adhesion with many types of solder. This material has excellent silver migration resistance. C4082 prints and holds 5 mil lines and spaces.
  • Key features: Excellent Ag migration resistance#High coverage#Outstanding leach resistance
  • Process Temperature: 850 °C peak temperatureDwell time of 9 – 11 minutes
  • Film Thickness : 10-15 um
  • Viscosity: 150 – 250 Kcps, Brookfield HBTSpindle #14 utility cup at 10 rpm, 25 °C
  • Conductivity: ≤ 100 milliohms/square at 12 um fired film thickness
  • Solids: 80.0 ± 1.0 %

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