• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: AgPt
  • Application: Hybrid IC
  • Description: C4741 is a Silver/Platinum conductor with 1.5 % Platinum in the wet paste. It is a new member of HERAEUS’ line of conductors with excellent fired film density, high conductivity and good solder leach resistance for applications at elevated temperatures.
  • Key features: Excellent leach resistance#Excellent initial and aged adhesion#High conductivity#Excellent fired film density
  • Process Temperature: Fire at 850 °C (peak) for 10-12 minutes, and with a total firing cycle time of c. 30-60 minutes.
  • Film Thickness : 10-15 um
  • Viscosity: 20-40 Pas (25 °C, D = 100/s)
  • Conductivity: ≤ 5.0 milliohms/square (FFT: 12 um)

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