• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: Au
  • Application: Hybrid IC
  • Description: C5020 is an unfritted lead, gold conductor. It is designed for application on top of a gold-based layer to increase thickness and solderability.In a single print and fire application on a gold base layer it yields a thick, dense film that is free from blisters, cracks, and other cosmetic defects.C5020 has good adhesion when printed over a gold base layer of Heraeus Au conductors. It is not designed to be used without a gold base layer.
  • Key features: Excellent choice for higher conductivity applications that require thick gold conductor
  • Process Temperature: Fire at 550-950 °C (peak) for 10 minutes, and with a total firing cycle time of c. 30-60 minutes.
  • Film Thickness : 6-10 um
  • Viscosity: 35-55 Pas (25 °C, D = 75/s)
  • Conductivity: ≤ 4.5 milliohms/square (FFT: 8 um)
  • Alloy Ratio: 100

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