• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: AuAg
  • Application: Hybrid IC
  • Description: C5729 is a gold conductor paste that has been formulated for use with Al or Au wire bond applications.
  • Key features: Excellent AI and Au bondability#High conductivity#Fine line printing
  • Process Temperature: 850 °C peak temperature, 10 minutes at peak. Total cycle time 45-60 minutes.
  • Film Thickness : 8-11 um
  • Viscosity: 380-480 Kcps, Brookfield HBTSC4-14 spindle and 6R utility cup at 10 rpm, 25 °C
  • Conductivity: ≤ 5.5 milliohms/square at 12 um fired film thickness using 25 mil wide serpentine conductor pattern

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