• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: Ag
  • Application: Hybrid IC
  • Description: C8829A is a low firing silver conductor paste. It exhibits excellent solderability on a wide variety of substrates including aluminum, anodized aluminum, alumina and soda lime glass.
  • Key features: Low firing temperature#Excellent solderability#Low resistivity Au and Al wire bondable
  • Process Temperature: 490-550 °C peak temperature. Dwell time of 5-8 minutes.
  • Film Thickness : 6-10 um
  • Viscosity: 150 -200 Kcps Brookfield HBTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Conductivity: ≤ 3.5 milliohms/square at 12 um fired film thickness
  • Alloy Ratio: 100

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