• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: Ag
  • Application: Heaters
  • Description: C8829D is a low firing silver conductive paste. It was developed for the Celcion® system and exhibits increased solder leach resistance and improved solderability.
  • Key features: Low firing temperature Increased solder leach resistance Improved solderability AI wire bondable
  • Process Temperature: 550-570 °C peak temperature. Dwell time of 5-7 minutes.
  • Film Thickness : 12-20 um
  • Viscosity: 150-200 Kcps, Brookfield HBTSC4-14 spindle and 6R utility cup at 10 rpm, 25 °C
  • Conductivity: ≤ 3.0 milliohms/square at 12 um fired film thickness
  • Alloy Ratio: 100

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