• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: AgPtPd
  • Application: Hybrid IC
  • Description: CL49-8241 is a mixed bonded Ag/Pd/Pt conductor material. It offers cost savings over standard Ag/Pd/Pt formulations while maintaining the advantages of leach resistance and aged adhesion. CL49-8241 is supplied with a rheology, which results in a dense, uniform fired film.
  • Key features: Low cost#Excellent solderability and leach resistance#Low resistivity#Excellent aged adhesion
  • Process Temperature: 850 °C peak temperature. Dwell time of 9-11 minutes.
  • Film Thickness : 10-15 um
  • Viscosity: 100-160 kcps; Brookfield HBT SC4-14 spindle and 6R utility cup @ 10 pm, 25°C
  • Conductivity: ≤ 5.0 milliohms per square at 12 microns fired film thickness
  • Solids: 80.25 ± 0.75%

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