ET1801

ET1801
  • Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: AgPtPd
  • Application: Capacitor - MLCC, chip
  • Description: ET1801 is a solderable Ag/Pd/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). ET1801 offers excellent solderability and leach resistance.
  • Key features: Suitable rheology for machine dip application#Excellent solderability and leach resistance#Compatible on titanate ceramic bodies
  • Process Temperature: 780-810 °C peak temperature. Dwell time of 5-6 minutes at peak.
  • Viscosity: 30-40 Kcps Brookfield RVTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Paste Function: Solderable

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