• Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: AgPtPd
  • Application: Capacitor - MLCC, chip
  • Description: ET1803B is a solderable Ag/Pd plus 3 % Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and adhesion.ET1803B is supplied at a viscosity suitable for machine dip and blot or no blot applications
  • Key features: Suitable rheology for machine dip application#Excellent solderability and leach resistance#Compatible on titanate ceramic bodies
  • Process Temperature: 780-810 °C at peak temperature. Dwell time of 5-6 minutes at peak.
  • Viscosity: 45-55 Kcps Brookfield RVT SC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Paste Function: Solderable

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