• Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: AgPt
  • Application: Capacitor - MLCC, chip
  • Description: ET1812A is a solderable Ag/Pt end termination designed for use on NPO MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and adhesion. ET1812A is supplied at a viscosity suitable for machine dip and blot or no blot applications
  • Key features: Suitable rheology for machine dip application#Excellent solderability and adhesion#Compatible on NPO dielectrics
  • Process Temperature: 780-810 ºC peak temperature. Dwell time of 5-6 minutes at peak.
  • Viscosity: 35-45 Kcps Brookfield RVTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Paste Function: Solderable

Discuss your solution

Talk to our experts and find the optimal solution for your applications.