• Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: Ag
  • Application: Capacitor - MLCC, chip
  • Description: ET1845A is a silver end termination designed for axial and radial lead attachment to MLCC (multilayer ceramic chip capacitors). ET1845A offers excellent solderability and adhesion. ET1845A is supplied at a rheology suitable for machine dip application.
  • Key features: Suitable rheology for machine dip application#Excellent solderability
  • Process Temperature: 780 ºC peak temperature. Dwell time of 4-6 minutes.
  • Viscosity: 35-45 Kcps, Brookfield RVT SC4-14 spindle and 6R cup at 10 rpm, 25 °C
  • Alloy Ratio: 100
  • Paste Function: Solderable

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