• Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: Ag
  • Application: Capacitor - MLCC, chip
  • Description: ET1847 is a silver end termination designed for axial and radial lead attachment to MLCC (multilayer ceramic chip capacitors). ET1847 offers excellent solderability and adhesion. ET1847 is supplied at a rheology suitable for machine dip application.
  • Key features: Suitable rheology for machine dip application#Excellent solderability
  • Process Temperature: 650-800 °C peak temperature. Dwell time of 4-6 minutes at peak.
  • Viscosity: 1525 Kcps Brookfield RVT SC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Alloy Ratio: 100
  • Paste Function: Solderable

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