• Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: AgPt
  • Application: Capacitor - MLCC, chip
  • Description: ET1857 is a Ag/Pt termination paste designed for use on a variety of ceramic components. It provides good adhesion, solderability, and leach resistance.
  • Key features: Rheology allows for printing, dipping, brushing or roll coating
  • Process Temperature: 850 °C peak temperature. Dwell time of 10 minutes at peak.
  • Viscosity: 50-60 Kcps Brookfield RVT SC4-14 spindle, 6R utility cup at10 rpm, 25 °C
  • Conductivity: ≤ 3.5 milliohms/square at 14 um fired film thickness
  • Paste Function: Solderable

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