• Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: Ag
  • Application: Capacitor - MLCC, chip
  • Description: ET1890A is a nickel plateable silver end termination designed to be compatible on Multilayer ceramic chip capacitors (NPO and X7R bodies). Nickel plating can be done without pre-plate processing due to the low glass content on the fired surface. The rheology of ET1890A is suitable for machine dipping.
  • Key features: Nickel plateable-no pre-plate processing#Low usage-excellent coverage uniformly#Dense fired microstructure
  • Process Temperature: Peak temp: 650-800 ºC. Dwell time at temp, 5-7 minutes.
  • Viscosity: 40-50 Kcps, Brookfield RVT SC4-14 spindle and 6R utility cup at 10 rpm, 25 °C
  • Alloy Ratio: 100
  • Paste Function: Plateable

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